Publikation:
Thermally actuated clamping of semiconductor chips during the soldering process
Datum
2022
Bachelorarbeit
Ikonic, D. (2022). Thermally actuated clamping of semiconductor chips during the soldering process. https://orix.ost.ch/handle/20.500.14978/18695
Zusätzliche Indizierung
| Departement / Abteilung | |
|---|---|
| Institut/ Bereich | |
| Studienabschluss | BSc |
| Studiengang | Systemtechnik / Mechatronik |
| Titel | Thermally actuated clamping of semiconductor chips during the soldering process |
| Sprache | eng |
| Autor:in | Ikonic, Dario |
| Betreuer:in | |
| Datum der Veröffentlichung | 2022 |
| Thematische Schwerpunkte | Microtechnology Mechanical Engineering |
| Weitere Angaben | BS Systemtechnik |
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