Publikation:
Thermally actuated clamping of semiconductor chips during the soldering process
Datum
2022
bachelor_thesis
Ikonic, D. (2022). Thermally actuated clamping of semiconductor chips during the soldering process. https://orix.ost.ch/handle/item/18695
Zusätzliche Indizierung
| Institut | EMS |
|---|---|
| Studienabschluss | BSc |
| Studiengang | Systemtechnik / Mechatronik |
| Titel | Thermally actuated clamping of semiconductor chips during the soldering process |
| Sprache | en |
| Autor / Autor:in | Ikonic, Dario |
| Betreuer:in | Prenzler, Jürgen |
| Datum der Veröffentlichung | 2022-09-18 |
| Thematische Schwerpunkte (Schlagwörter) | Microtechnology Mechanical Engineering |
| Weitere Angaben | BS Systemtechnik |
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